Wafer bump automatic inspection system 'RWi-300MK3'
Ideal for gold bump 3D inspection! Achieves simultaneous measurement of 3D/2D/SD with high speed and high precision.
We would like to introduce our high-speed, high-precision 3D/2D/SD wafer bump automatic inspection system, the 'RWi-300MK3'. The measurement accuracy for 2D/3D has significantly improved, enabling ultra-fast inspections. Additionally, the speed of defect image acquisition has dramatically increased. Please feel free to contact us if you require further information. 【Features】 ■ Simultaneous measurement of 3D/2D/SD achieved with high speed and high precision ■ Suitable for gold bump 3D inspection ■ Diverse transport systems *For more details, please download the PDF or feel free to contact us.
- Company：ニデックアドバンステクノロジー 本社、東京営業所、名古屋営業所
- Price：Other
